PART |
Description |
Maker |
PS7801-A-F3 PS7801 PS7801-A-F4 PS7801-1A |
LEAD FREE A6279 SOIC 邻舍4针超小型平引脚,低输出电通道光学耦合MOSFET LEAD FREE A6279ELP-T WITH TAPE & REEL LEAD FREE A6279ELW-T WITH TAPE & REEL NECs 4-PIN ULTRA SMALL FLAT-LEAD, LOW OUTPUT CAPACITANCE 1-CH OPTICAL COUPLED MOSFET NECs 4-PIN ULTRA SMALL FLAT-LEAD / LOW OUTPUT CAPACITANCE 1-CH OPTICAL COUPLED MOSFET NECs 4-PIN ULTRA SMALL FLAT-LEAD LOW OUTPUT CAPACITANCE 1-CH OPTICAL COUPLED MOSFET
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NEC, Corp. NEC Corp. NEC[NEC]
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87891-1818 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free 2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
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Molex Electronics Ltd.
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0526100675 0526101675 0526101275 0526101475 |
1.0 FPC CONN ZIF FOR SMT (ST)WITH TAPE -LEAD FREE- 1.0 FPC CONN ZIF FOR SMT (ST)WITH TAPE -LEAD FREE-
|
Molex Electronics Ltd.
|
0878980554 87898-0554 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-free 2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-free
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Molex Electronics Ltd.
|
0878980568 87898-0568 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free 2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free
|
Molex Electronics Ltd.
|
54819-0572 |
USB On-The-Go (OTG) Mini-B Receptacle, Right Angle, SMT Solder Tails and ShellTabs, with Cover Tape, Lead-free
|
Molex Electronics Ltd.
|
PT510 PT501 PT510A PT501C PT510C PT501A PT501B |
PHOTOTRANSISTOR | NPN | 800NM PEAK WAVELENGTH | CAN-4.7 光电晶体管|叩| 800NM峰值波长|的CAN - 4.7 55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU2405 with Lead Free Packaging 150V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFSL33N15D with Lead Free Packaging such as active OR'ing. Shipped in Tape and Reel only. Part is not available in bulk, TR is implied in part number.; A IRF6610 with Standard Tape and Reel 55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF2805S with Standard Packaging TO-18 Type Narrow Acceptance Phototransistor
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Sharp Electrionic Components
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0565790576 |
USB On-The-Go (OTG) Mini-AB Receptacle, Right Angle, SMT Solder Tails and ShellTabs, with Cover Tape, Lead-Free USB On-The-Go (OTG) Mini-AB Receptacle, Right Angle, SMT Solder Tails and ShellTabs, with Cover Tape, Lead-Free
|
Molex Electronics Ltd.
|
53375-0790 |
2.50mm (.098) Pitch Mini-Lock Wire-to-Board Header, Vertical, Friction and PositiveLock, Radial Tape Packaging, 7 Circuits, Lead-free
|
Molex Electronics Ltd.
|
0533750290 53375-0290 |
2.50mm (.098) Pitch Mini-Lock Wire-to-Board Header, Vertical, Friction and PositiveLock, Radial Tape Packaging, 2 Circuits, Lead-free
|
Molex Electronics Ltd.
|
53426-0490 0534260490 |
2.50mm (.098) Pitch Mini-Lock?/a> Wire-to-Board Header, Right Angle, Friction andPositive Lock, Radial Tape Packaging, 4 Circuits, Lead-free 2.50mm (.098) Pitch Mini-Lock Wire-to-Board Header, Right Angle, Friction andPositive Lock, Radial Tape Packaging, 4 Circuits, Lead-free
|
Molex Electronics Ltd.
|
87920-9311 0879209311 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Overall Plating, with Cap, without Peg, Tape on Reel Packaging, Lead-free
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Molex Electronics Ltd.
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